IEEE

Investigation of Polyimide Cracking Effects in Wafer-Level Chip Scale Package on Substrate (WLCSPoS) During Component-Level and Board-Level Reliability Testing

Abstract: Polyimide cracking is a significant reliability challenge when packing a Wafer-Level Chip Packaging (WLCSP) on substrate with normal flip chip process. In this study, 3-layer WLCSPs were ...
IEEE

Optimization of Core Material Properties for Large Flip-chip Ball Grid Array Substrate to Manage Both Warpage and Board Level Reliability

Abstract: A large silicon chip or interposer is mounted onto a large package substrate using flip-chip for high performance computing (HPC) such as artificial intelligence (AI) and fifth generation ...
The Atlantic

The Entry-Level Hiring Process Is Breaking Down

Even in the best of times, searching for a first job after college is an exercise in patience, resilience, and coping with rejection. And these are not the best of times. Companies have no idea which ...
The Cincinnati Enquirer

What is the snow emergency level in light of Saturday's winter storm?

This story will be updated as more snow emergencies are declared. Several cities and and counties have declared snow emergencies as heavy snow is expected to wallop Greater Cincinnati on Saturday, Dec ...