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ROHM Develops 5th Generation SiC MOSFETs with Approx. 30% Lower On-Resistance at High Temperatures

ROHM has developed the latest device of its EcoSiC series: the 5th Generation SiC MOSFETs optimized for highefficiency power applications. This technology is ideally suitable for automotive electric ...
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Vector Expands CANoe Test Package EV With Security Tests for Charging Communication

Vector Informatik is expanding the CANoe Test Package EV to include dedicated security tests for charging communication. The extension supports manufacturers and suppliers identify vulnerabilities in ...
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NOVELIC’s Award-Winning ACAM In-Cabin Monitoring Solution Developed Using HighTec Development Platform

HighTec EDV-Systeme GmbH, the world’s leading independent provider of commercial open-source compiler technologies for embedded systems, today announced that NOVELIC’s Automotive Cabin Advanced ...
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Infineon Technologies and Intel Collaborate to Serve the Rapidly Expanding Trusted Platform Module Market

Neubiberg, Germany – March 5, 2008 – Infineon Technologies AG (IFX: FSE, NYSE) today announced a collaboration with Intel Corporation to serve the expanding TPM (Trusted Platform Module) market.
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ROHM entwickelt SiC-MOSFETs der fünften Generation: ca. 30 % geringerer Durchlasswiderstand bei hohen Temperaturen

Willich-Münchheide, 21. April 2026 – Mit den SiC-MOSFETs der fünften Generation hat ROHM die neuesten Bauelemente seiner EcoSiC-Serie entwickelt. Die Technologie ist für hocheffiziente Leistungsanwend ...
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Vector erweitert CANoe Test Package EV um Security Tests für die Ladekommunikation

Stuttgart, 14.04.2026 – Vector Informatik erweitert das CANoe Test Package EV um spezifische Security-Tests für die Ladekommunikation. Die Erweiterung unterstützt Hersteller und Zulieferer dabei, Schw ...
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Keysight erweitert sein Portfolio für virtuelle Fertigung um die Simulation Assembly

Böblingen, 14. April 2026 – Keysight Technologies hat heute Keysight Assembly vorgestellt, eine neue Lösung zur virtuellen Prozesssimulation, die Herstellern dabei helfen soll, Fertigungsprobleme früh ...
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ROHM has Introduced Reference Designs for Three-Phase Inverters Featuring New SiC Power Modules

» ROHM Semiconductor » Press Releases » Press Release Date: 17.03.2026 14:00 Number: PR07/26EN » Press Photos ROHM has Introduced Reference Designs for Three-Phase Inverters Featuring New SiC Power ...
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ROHM's SiC MOSFET Adopted for Mass Production in Toyota's New BEV "bZ5" for the Chinese Market

Willich-Münchheide, Germany, June 23, 2025 – The power module equipped with ROHM Co., Ltd.'s 4 th generation SiC MOSFET bare chip has been adopted in the traction inverter of Toyota Motor ...
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ROHM Strengthens Supply Capability for GaN Power Devices

Combining TSMC’s Process Technology to Build an End-to-End, In-Group Production System ROHM Co., Ltd. (hereinafter “ROHM”) has decided to integrate its own development and manufacturing technologies ...
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AI, Rust and C/C++ for Automotive Innovations: HighTec Demonstrates Multi-Architecture, Multi-Language Development Platform

HighTec Development Platform for automotive software development across multiple architectures, programming languages Rust and C/C++, and modern technologies including AI and model-based design ...
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MIPS and INOVA Collaborate to put Physical AI into the palm of Robotic hands with new Reference Platform

New platform will be a hardware-based custom SoC solution enacting sense-think-act-communicate signal chains to reduce size, weight and power constraints Flexible and scalable architecture reduces ...