Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...

System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

Owens Corning (Toledo, OH) has debuted a multi-end roving designed for epoxy sheet molding compound (SMC) systems in automotive applications. In combination with such systems, ME1510 glass ...

Compression molded bulk carbon/epoxy molding compound costs significantly less than hand-layed sandwich construction because much of the latter’s touch labor is eliminated. The molding process enables ...

In the automotive industry, especially in lightweight construction for hybrids and electric vehicles, there is growing demand for components that are not just light, but also exhibit high stiffness ...

Epoxies to keep up with fast HP-RTM: This high-pressure RTM equipment in use at specialist vehicle manufacturer Penso Consulting Ltd. in the UK is molding parts with Cytec’s fast-cure epoxy, XMTM710.