Engineering considerations in multi-chiplet designs.

Through-silicon vias (TSVs) provide essential interconnects between DRAM dies inside high-bandwidth memory stacks, silicon ...

Coverage closure; EM sim for AMS; CXL 4; root of trust for ATMs.

Researchers at the University of California San Diego and Rutgers University created a brain-inspired device combining memory ...

When Finland’s Donut Lab claimed earlier this year that it had developed a solid-state battery capable of storing 400 ...

Massive rounds for AI, EDA, and manufacturing; 80 startups raise $8.4B.

AI workloads are driving their adoption in data centers. On the other hand, photonic interconnects require a variety of ...

Large systems companies are pressing EDA vendors for performance improvements to keep pace with their AI workflows. The ...

Leveraging patterns in formal verification to reach sign-off faster.

Advances in GPU computing and multi-beam mask writing are removing constraints to enable entirely curvilinear masks.

Fine-tuning TCAD parameters with real-world feedback from test wafers is essential for quantitatively accurate and predictive results.

Panel-level packaging is arriving not because the engineering is ready, but because wafer-level economics are breaking down.