Charlotte, N.C., Feb. 01, 2021 (GLOBE NEWSWIRE) -- Akoustis Technologies, Inc. (NASDAQ: AKTS) (“Akoustis” or the “Company”), an integrated device manufacturer (IDM) of patented bulk acoustic wave (BAW ...
However, sTIMs cannot be used alone, they require backside metallization (BSM) on the module to establish a thermal path and adhesion between the lid, sTIM, and the module. Conventional BSM processing ...
How a real chip-last process flow with a chip-to-wafer (C2W) bonding technology can address the RDL-base Interposer PoP challenge. Fan-Out Wafer-Level Interposer Package-on Package (PoP) design has ...
—The development of a process flow capable of demonstrating functionality of a monolithic complementary FET (CFET) transistor architecture is complex due to the need to vertically separate nMOS and ...
To support McCrometer’s European customers, the high-accuracy, virtually no-maintenance Wafer-Cone Flow Meter meets the requirements of the European Community’s Pressure Equipment Directive (PED) ...
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