Design engineers are increasingly turning to 3D ICs to keep pace with the ascent of next-generation AI scaling.
3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...
In the burgeoning Low-Earth Orbit (LEO) satellite market, Taiwanese manufacturers have traditionally found their niche in subcontracting component assembly and antenna integration, rather than carving ...
TSMC has proclaimed a team from Yuan Ze University as winners of the first TSMC IC Layout Contest. They win a cash prize of NT$200,000. TSMC launched its first IC Layout Contest to encourage Taiwan ...
As the complexity of IC designs continues to grow, moving critical checks earlier in the design cycle helps designers identify and resolve issues before they escalate, streamlining the overall ...
In the realm of high-performance IC (integrated circuit) design, symmetry is not just an aesthetic preference—it’s a critical factor for ensuring proper device functionality, especially in analog and ...
Astrus, a Canada-based startup focusing on analog IC design automation, is aspiring to revolutionize the global chip design industry by leveraging recent breakthroughs in artificial intelligence (AI).
Industry’s leading platform for creating differentiated custom silicon delivers unmatched productivity benefits with new generative AI technology Virtuoso Studio empowers designers to push ...
Advancements in technology have led to the development of increasingly complex and densely integrated circuits (ICs). To keep up with the ever-growing demand for high-performance and power-efficient ...
The AI revolution is driving change in how we design and manufacture everything from data centers to servers and chips. Even what we consider a chip is changing from the integration of analog circuits ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results