Kenji Hata (Prime Senior Researcher), the Nanotube Research Center (NTRC; Director: Sumio Iijima) of the National Institute of Advanced Industrial Science and Technology (AIST; President: Ryoji ...
Copper plating has been extensively employed in the fabrication of embedded packaging to reach high-density, high-speed, high performance electronic products. With through holes (TH) as well as blind ...
Lithium metal shows great promise as an anode material for next-generation high-energy-density batteries. However, the issues of dendrite growth and huge volume fluctuations that occur with lithium ...
A reduction of silver consumption in PV production is required on the way to terawatt scale. Given this, the time may have come for the commercialization of new copper plating technologies – doing ...
San Jose, California – October 20, 2009 – Novellus Systems (NASDAQ: NVLS) today introduced the SABRE Excel, an advanced copper electroplating system designed to provide industry-leading fill and ...
FREMONT, Calif., March 10, 2021 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...
Electroplating intermediates refer to a class of fine chemicals used as electroplating additives. Unlike the salt used in the plating production process, the electroplating intermediate is an additive ...
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