SEM (scanning electron microscope) images of test chip designed by Deca. Upper left show a molded multi-chip fan-out package with close-ups of the embedded die right and below The last time I wrote ...
As the demand for advanced packaging technologies like CoWoS (Chip-on-Wafer-on-Substrate) continues to outpace supply, the semiconductor packaging equipment supply chain is increasingly optimistic ...
EUV optics, light sources, ultra-clean vacuum modules, RF power, precision mechatronics, and abatement systems each come from ...
TOKYO/SEOUL, March 31 (Reuters) - South Korea's Samsung Electronics Co Ltd (005930.KS), opens new tab is considering setting up a chip packaging test line in Japan, five people said, to bolster its ...
Taiwan-based AblePrint Technology, a key supplier of advanced packaging defoaming equipment for major clients including TSMC, reported record-breaking performance despite earlier regulatory scrutiny.
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China’s chip industry boom: Why it still falls short
China’s semiconductor industry is having a moment. New fabrication plants are being announced, domestic chip designers are scaling quickly, and ...
Once the design is complete, testing usually happens on an FPGA (Field Programmable Gate Array). For anyone who has not encountered the term yet, an FPGA is a reprogrammable chip that you can program ...
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