Today’s 3D integrated circuit (3D-IC) technology is the culmination of 40 years of research in universities and laboratories scattered across the globe. Beginning with dynamic random-access memory ...
Innovation in semiconductor design today is energized primarily by AI/ML, data centers, autonomous and electric vehicles, 5G/6G, and IoT. Recently developed 2.5 and 3D-IC silicon-based packaging ...
Multi-scale 3D CT imaging enables digital twinning, high-fidelity simulation of composite structures
Paul Compston, CEO and director; Silvano Sommacal, technical lead, Advanced Diagnostics Division; and John Holmes, senior engineer, New Frontier Technologies Shown here is the laser tape placement ...
Digital twins are virtual replicas of physical systems that learn, simulate, and predict performance and emerging as one of medicine’s most intriguing and controversial frontiers. Once an abstract ...
Selected among the 2025 global top startups in Singapore's Slingshot Top 250, Saudi Arabia's EWC 2025 Top 250, and Europe's Sber500 Top 25, expanding an end-to-end design-to-manufacture 3D workflow ...
How to insert and manipulate 3D models in Microsoft Word Your email has been sent Microsoft 365 applications can fake 3D shapes and letters, but the effect is often less than satisfying. If you must ...
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